aep Technology - providing products, services, programs to the metrology market from complete product to OEM solutions. We bring solutions to you.

aep Technology - We bring solutions to you.


	Thin and thick film step heights measurement Surface Roughness measurement Quantify scratch and dig features, wear depth, width and volume Flatness or curvature measurement 2D thin film stress measurement Film thickness Surface Profiling - defect, features etc.		Applications Thin Film Stress measurement AEP testers can be used to measure film stress of large samples by several methods. Following are recommendations for choice of technique Stress sensor - For product information click here. 3d Sensor - For product information click here. Contact Profilometer NanoMap-LS Wafer/ Material bowing is measured using contact profilometer. The radius of curvature over large distance (several mm) is used to calculate stress in the film. For product information click here. Optical Profilometer NanoMap-O Wafer/ Material bowing is measured using contact profilometer. The radius of curvature over large distance (several mm) is used to calculate stress in the film. For product information click here. Contact + Optical Profilometer NanoMap-D - For product information click here.